Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737353 | Semiconductor device having bump electrodes | Jen-Kuang Fang, Ching-Hua Chiang, Chau Fu Weng | 2004-05-18 |
| 6716736 | Method for manufacturing an under-bump metallurgy layer | Chih-Hsiang Hsu | 2004-04-06 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shyh-Ing Wu +5 more | 2004-02-17 |