Issued Patents 2004
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6827252 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2004-12-07 |
| 6820329 | Method of manufacturing multi-chip stacking package | — | 2004-11-23 |
| 6756256 | Method for preventing burnt fuse pad from further electrical connection | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-06-29 |
| 6743707 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-06-01 |
| 6737353 | Semiconductor device having bump electrodes | Ching-Hua Chiang, Shih-Kuang Chen, Chau Fu Weng | 2004-05-18 |
| 6732912 | Solder ball attaching process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-05-11 |
| 6723630 | Solder ball fabrication process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-04-20 |
| 6720244 | Bump fabrication method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-04-13 |
| 6716739 | Bump manufacturing method | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +2 more | 2004-04-06 |
| 6713870 | Wafer level chip-scale package | — | 2004-03-30 |
| 6713320 | Bumping process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2004-03-30 |
| 6692581 | Solder paste for fabricating bump | Ho-Ming Tong, Chun-Chi Lee, Ching-Fu Horng, Shih-Kuang Chen, Shyh-Ing Wu +5 more | 2004-02-17 |
| 6673711 | Solder ball fabricating process | Ho-Ming Tong, Chun-Chi Lee, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su +3 more | 2004-01-06 |