Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6822324 | Wafer-level package with a cavity and fabricating method thereof | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-11-23 |
| 6809852 | Microsystem package structure | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-10-26 |
| 6768207 | Multichip wafer-level package and method for manufacturing the same | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-07-27 |
| 6693364 | Optical integrated circuit element package and process for making the same | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-02-17 |