Issued Patents 2004
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6750397 | Thermally enhanced semiconductor build-up package | In-De Ou, Yi Ding | 2004-06-15 |
| 6737300 | Chip scale package and manufacturing method | Yi Ding, Xin Lee | 2004-05-18 |
| 6714421 | Flip chip package substrate | Ho-Ming Tong, Chun-Chi Lee | 2004-03-30 |
| 6701614 | Method for making a build-up package of a semiconductor | Yi Ding, In-De Ou | 2004-03-09 |
| 6680529 | Semiconductor build-up package | Yi Ding, In-De Ou | 2004-01-20 |