Issued Patents 2004
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828687 | Cavity down ball grid array package structure and carrier thereof | — | 2004-12-07 |
| 6805972 | Method of forming nanoporous membranes | Jonah D. Erlebacher | 2004-10-19 |
| 6750397 | Thermally enhanced semiconductor build-up package | In-De Ou, Kun-Ching Chen | 2004-06-15 |
| 6743675 | Floating gate memory fabrication methods comprising a field dielectric etch with a horizontal etch component | — | 2004-06-01 |
| 6744237 | Hybrid power system for an electric vehicle | Bruce M. Kopf, Jing Song | 2004-06-01 |
| 6737300 | Chip scale package and manufacturing method | Xin Lee, Kun-Ching Chen | 2004-05-18 |
| 6733909 | Fuel cell power plant with electrochemical enhanced carbon monoxide removal | Joseph Carl Burba | 2004-05-11 |
| 6701614 | Method for making a build-up package of a semiconductor | In-De Ou, Kun-Ching Chen | 2004-03-09 |
| 6690036 | Method and apparatus for steering an optical beam in a semiconductor substrate | Ansheng Liu, Mario Paniccia, Michael T. Morse, Dmitri E. Nikonov | 2004-02-10 |
| 6680529 | Semiconductor build-up package | Kun-Ching Chen, In-De Ou | 2004-01-20 |