Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6750397 | Thermally enhanced semiconductor build-up package | Yi Ding, Kun-Ching Chen | 2004-06-15 |
| 6701614 | Method for making a build-up package of a semiconductor | Yi Ding, Kun-Ching Chen | 2004-03-09 |
| 6680529 | Semiconductor build-up package | Kun-Ching Chen, Yi Ding | 2004-01-20 |