Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6833610 | Bridge connection type of chip package and fabricating method thereof | — | 2004-12-21 |
| 6828664 | Packaging substrate with electrostatic discharge protection | Yung-Chi Lee | 2004-12-07 |
| 6825568 | Flip chip package structure and flip chip device with area bump | — | 2004-11-30 |