Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653203 | Thin sidewall multi-step HDP deposition method to achieve completely filled high aspect ratio trenches | Tsung-Hsun Huang, Chung-Yi Yu | 2003-11-25 |
| 6579791 | Method to form dual damascene structure | Chia-Shiung Tsai, Min-hwa Chi | 2003-06-17 |
| 6566250 | Method for forming a self aligned capping layer | Chih-Yang Pai, Chia-Shiung Tsai | 2003-05-20 |
| 6555442 | Method of forming shallow trench isolation with rounded corner and divot-free by using disposable spacer | Chih-Yang Pai, Chih-Hsing Yu, Chia-Shiung Tsai, Min-hwa Chi | 2003-04-29 |
| 6528366 | Fabrication methods of vertical metal-insulator-metal (MIM) capacitor for advanced embedded DRAM applications | Dah-Chih Lin, Min-hwa Chi | 2003-03-04 |