Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Chender Huang, Jones Wang, Ken-Ching Chen, Hank Huang | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Chender Huang, Jones Wang, Ken-Ching Chen, Hank Huang | 2003-10-28 |
| 6630624 | Electrical cable with grounding means | Frank Quach | 2003-10-07 |
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package | Jones Wang, Ken-Ching Chen | 2003-08-19 |
| 6596619 | Method for fabricating an under bump metallization structure | Chung Yu Wang, Chender Huang, Ken-Ching Chen, Hank Huang | 2003-07-22 |
| 6552267 | Microelectronic assembly with stiffening member | Ken-Ching Chen | 2003-04-22 |
| 6528417 | Metal patterned structure for SiN surface adhesion enhancement | Chung Yu Wang, Chender Huang, Ken-Ching Chen | 2003-03-04 |