Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596619 | Method for fabricating an under bump metallization structure | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen, Hank Huang | 2003-07-22 |
| 6528417 | Metal patterned structure for SiN surface adhesion enhancement | Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2003-03-04 |