Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Pei-Haw Tsao, Chender Huang, Jones Wang, Ken-Ching Chen | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Pei-Haw Tsao, Chender Huang, Jones Wang, Ken-Ching Chen | 2003-10-28 |
| 6596619 | Method for fabricating an under bump metallization structure | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Ken-Ching Chen | 2003-07-22 |