Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Pei-Haw Tsao, Chender Huang, Jones Wang, Hank Huang | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Pei-Haw Tsao, Chender Huang, Jones Wang, Hank Huang | 2003-10-28 |
| 6632037 | Keyboard assembly with positioning function | Winky Lin, Ren-Long Kuo | 2003-10-14 |
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package | Pei-Haw Tsao, Jones Wang | 2003-08-19 |
| 6596619 | Method for fabricating an under bump metallization structure | Chung Yu Wang, Chender Huang, Pei-Haw Tsao, Hank Huang | 2003-07-22 |
| 6585337 | Forward pull type latch structure of a slide | Shih-Long Hwang, Chun-Chiang Wang | 2003-07-01 |
| 6585335 | Rear-section bolt lock structure of a slide | Shih-Long Hwang, Chun-Chiang Wang | 2003-07-01 |
| 6552267 | Microelectronic assembly with stiffening member | Pei-Haw Tsao | 2003-04-22 |
| 6528417 | Metal patterned structure for SiN surface adhesion enhancement | Chung Yu Wang, Chender Huang, Pei-Haw Tsao | 2003-03-04 |