Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656827 | Electrical performance enhanced wafer level chip scale package with ground | Pei-Haw Tsao, Chender Huang, Ken-Ching Chen, Hank Huang | 2003-12-02 |
| 6638837 | Method for protecting the front side of semiconductor wafers | Pei-Haw Tsao, Chender Huang, Ken-Ching Chen, Hank Huang | 2003-10-28 |
| 6607942 | Method of fabricating as grooved heat spreader for stress reduction in an IC package | Pei-Haw Tsao, Ken-Ching Chen | 2003-08-19 |