Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670274 | Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structure | Ying-Lang Wang | 2003-12-30 |
| 6660638 | CMP process leaving no residual oxide layer or slurry particles | Ying-Lang Wang, Shih-Chi Lin, Yi-Lung Cheng, Ming-Hua Yoo, Wen-Kung Cheng +1 more | 2003-12-09 |