Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6613986 | Multilayer build-up wiring board | Honjin En | 2003-09-02 |
| 6609297 | Method of manufacturing multilayer printed wiring board | Yasuji Hiramatsu, Motoo Asai, Takashi Kariya | 2003-08-26 |
| 6591495 | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating | Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada, Naoto Ishida +2 more | 2003-07-15 |