Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6609297 | Method of manufacturing multilayer printed wiring board | Yasuji Hiramatsu, Naohiro Hirose, Takashi Kariya | 2003-08-26 |
| 6607825 | Metal film bonded body, bonding agent layer and bonding agent | Dong Wang | 2003-08-19 |
| 6534723 | Multilayer printed-circuit board and semiconductor device | Takashi Kariya | 2003-03-18 |
| 6525275 | Multilayer printed circuit boards | — | 2003-02-25 |