Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6591495 | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Honjin En, Naoto Ishida +2 more | 2003-07-15 |
| 6590165 | Printed wiring board having throughole and annular lands | Masaru Takada, Hiroyuki Kobayashi, Hisashi Minoura, Yoshikazu Ukai, Mitsuhiro Kondo | 2003-07-08 |
| 6555208 | Printed wiring board and method of manufacturing the same | Masaru Takada, Hiroyuki Kobayashi, Kenji Chihara, Hisashi Minoura, Mitsuhiro Kondo | 2003-04-29 |