Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6591495 | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Honjin En, Kiyotaka Tsukada +2 more | 2003-07-15 |