Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6613986 | Multilayer build-up wiring board | Naohiro Hirose | 2003-09-02 |
| 6591495 | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating | Naohiro Hirose, Kouta Noda, Hiroshi Segawa, Kiyotaka Tsukada, Naoto Ishida +2 more | 2003-07-15 |