Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638859 | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition | Ofer Sneh, Thomas E. Seidel | 2003-10-28 |
| 6635570 | PECVD and CVD processes for WNx deposition | Claude A. Sands, Hector Velasco, Lawrence D. Matthysse, Thomas E. Seidel | 2003-10-21 |
| 6540838 | Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer deposition | Ofer Sneh | 2003-04-01 |
| 6538327 | Method of copper interconnect formation using atomic layer copper deposition and a device thereby formed | Sergey Lopatin, Takeshi Nogami | 2003-03-25 |
| 6503330 | Apparatus and method to achieve continuous interface and ultrathin film during atomic layer deposition | Ofer Sneh, Thomas E. Seidel | 2003-01-07 |