Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660634 | Method of forming reliable capped copper interconnects | Minh Van Ngo, Shekhar Pramanick | 2003-12-09 |
| 6602787 | Method for fabricating semiconductor devices | Naoki Komai, Hideyuki Kito, Mitsuru Taguchi | 2003-08-05 |
| 6563222 | Method and apparatus for reducing electromigration in semiconductor interconnect lines | Sergey Lopatin | 2003-05-13 |
| 6538327 | Method of copper interconnect formation using atomic layer copper deposition and a device thereby formed | Sergey Lopatin, Carl Galewski | 2003-03-25 |
| 6524429 | Method of forming buried wiring, and apparatus for processing substratum | Naoki Komai, Koichi Ikeda, Takashi Kinoshita, Kohei Suzuki, Nobuyuki Kawakami +1 more | 2003-02-25 |