Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656996 | Semiconductor-sealing resin composition and semiconductor device using it | Yasuaki Tsutsumi, Tetsuya Mieda, Masayuki Tanaka, Yukio Takigawa | 2003-12-02 |
| 6573121 | Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame | Yoshiyuki Yoneda, Ryuji Nomoto, Toshiyuki Motooka, Kazuto Tsuji, Junichi Kasai +3 more | 2003-06-03 |
| 6563330 | Probe card and method of testing wafer having a plurality of semiconductor devices | Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida +2 more | 2003-05-13 |
| 6541848 | Semiconductor device including stud bumps as external connection terminals | Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi | 2003-04-01 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2003-01-28 |
| 6507092 | Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same | Norio Fukasawa, Takashi Hozumi | 2003-01-14 |