Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6563207 | Split-mold and method for manufacturing semiconductor device by using the same | — | 2003-05-13 |
| 6515347 | Wafer level semiconductor device and method of manufacturing the same | Norio Fukasawa, Takashi Hozumi, Toshimi Kawashara, Masamitsu Ikumo | 2003-02-04 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Toshimi Kawahara, Hirohisa Matsuki, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2003-01-28 |