Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541848 | Semiconductor device including stud bumps as external connection terminals | Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko | 2003-04-01 |
| 6515347 | Wafer level semiconductor device and method of manufacturing the same | Yasuhiro Shinma, Norio Fukasawa, Toshimi Kawashara, Masamitsu Ikumo | 2003-02-04 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa +2 more | 2003-01-28 |
| 6507092 | Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the same | Norio Fukasawa, Toshimi Kawahara | 2003-01-14 |