Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650957 | Method and apparatus for run-to-run control of deposition process | William J. Campbell, Thomas J. Sonderman | 2003-11-18 |
| 6630360 | Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization | James Stice | 2003-10-07 |
| 6512991 | Method and apparatus for reducing deposition variation by modeling post-clean chamber performance | Bradley Marc Davis, Allen L. Evans | 2003-01-28 |