Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6663472 | Multiple step CMP polishing | Chen Feng, Subramanian Balakumar, Paul Proctor | 2003-12-16 |
| 6649517 | Copper metal structure for the reduction of intra-metal capacitance | Young Way Teh, Ting Cheong Ang | 2003-11-18 |
| 6531386 | Method to fabricate dish-free copper interconnects | Simon Chooi, Randall Cher Liang Cha | 2003-03-11 |