Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6496748 | Wafer flattening process and storage medium | Shinya Iida, Yasuhiro Horiike | 2002-12-17 |
| 6451217 | Wafer etching method | Chikai Tanaka, Shinya Iida, Yasuhiro Horiike | 2002-09-17 |
| 6432824 | Method for manufacturing a semiconductor wafer | — | 2002-08-13 |
| 6429399 | Discharge tube for a local etching apparatus and a local etching apparatus using the discharge tube | Tadayoshi Okuya | 2002-08-06 |
| 6406589 | Processing apparatus for etching the edge of a silicon wafer | — | 2002-06-18 |
| 6360687 | Wafer flattening system | Takeshi Sadohara, Chikai Tanaka, Shinya Iida, Yasuhiro Horiike | 2002-03-26 |