Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6496748 | Wafer flattening process and storage medium | Michihiko Yanagisawa, Yasuhiro Horiike | 2002-12-17 |
| 6451217 | Wafer etching method | Michihiko Yanagisawa, Chikai Tanaka, Yasuhiro Horiike | 2002-09-17 |
| 6360687 | Wafer flattening system | Michihiko Yanagisawa, Takeshi Sadohara, Chikai Tanaka, Yasuhiro Horiike | 2002-03-26 |