YH

Yasuhiro Horiike

UN Unknown: 3 patents #31 of 2,778Top 2%
SP Speedfam-Ipec: 2 patents #13 of 65Top 20%
Applied Materials: 1 patents #371 of 912Top 45%
SC Speedfam Co.: 1 patents #3 of 7Top 45%
Overall (2002): #10,904 of 266,432Top 5%
4
Patents 2002

Issued Patents 2002

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6496748 Wafer flattening process and storage medium Michihiko Yanagisawa, Shinya Iida 2002-12-17
6461533 Etchant for silicon oxide and method Yoshio Ishikawa, Keiji Horioka 2002-10-08
6451217 Wafer etching method Michihiko Yanagisawa, Chikai Tanaka, Shinya Iida 2002-09-17
6360687 Wafer flattening system Michihiko Yanagisawa, Takeshi Sadohara, Chikai Tanaka, Shinya Iida 2002-03-26