Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Myung-Kee Chung, In-Ku Kang, Kwan-Jai Lee | 2002-09-10 |
| 6407459 | Chip scale package | Yong-Hwan Kwon | 2002-06-18 |
| 6376279 | method for manufacturing a semiconductor package | Yong-Hwan Kwon, Nam-Seog Kim, Dong-Hyeon Jang | 2002-04-23 |