Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Sa-Yoon Kang, Myung-Kee Chung, In-Ku Kang, Kwan-Jai Lee | 2002-09-10 |
HK
Hyeong-Seob Kim
Overall (2002): #202,337 of 266,432Top 80%
1
Patents 2002