Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Sa-Yoon Kang, Myung-Kee Chung, In-Ku Kang | 2002-09-10 |