Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6448661 | Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof | Hyeong-Seob Kim, Sa-Yoon Kang, In-Ku Kang, Kwan-Jai Lee | 2002-09-10 |
| 6348363 | Method for manufacturing a semiconductor package | Hee-Kook Choi, San Yeop Lee | 2002-02-19 |