Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6476494 | Silver-tin alloy solder bumps | Nam-jung Hur, Jong-Han Park | 2002-11-05 |
| 6407459 | Chip scale package | Sa-Yoon Kang | 2002-06-18 |
| 6376279 | method for manufacturing a semiconductor package | Sa-Yoon Kang, Nam-Seog Kim, Dong-Hyeon Jang | 2002-04-23 |