HT

Homayoun Talieh

NU Nutool: 13 patents #1 of 9Top 15%
Applied Materials: 1 patents #371 of 912Top 45%
📍 San Jose, CA: #10 of 2,494 inventorsTop 1%
🗺 California: #89 of 26,763 inventorsTop 1%
Overall (2002): #713 of 266,432Top 1%
14
Patents 2002

Issued Patents 2002

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating Cyprian Emeka Uzoh, Bulent M. Basol 2002-12-24
6482307 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Jalal Ashjaee, Boguslaw Nagorski, Bulent M. Basol, Cyprian Emeka Uzoh 2002-11-19
6478936 Anode assembly for plating and planarizing a conductive layer Rimma Volodarsky, Konstantin Volodarsky, Cyprian Emeka Uzoh, Douglas W. Young 2002-11-12
6471847 Method for forming an electrical contact with a semiconductor substrate Bulent M. Basol 2002-10-29
6468139 Polishing apparatus and method with a refreshing polishing belt and loadable housing Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young 2002-10-22
6464571 Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young 2002-10-15
6413403 Method and apparatus employing pad designs and structures with improved fluid distribution Paul Lindquist, Bulent M. Basol, Cyprian Emeka Uzoh 2002-07-02
6413388 Pad designs and structures for a versatile materials processing apparatus Cyprian Emeka Uzoh, Bulent M. Basol 2002-07-02
6409904 Method and apparatus for depositing and controlling the texture of a thin film Cyprian Emeka Uzoh 2002-06-25
6402925 Method and apparatus for electrochemical mechanical deposition 2002-06-11
6398625 Apparatus and method of polishing with slurry delivery through a polishing pad 2002-06-04
6355153 Chip interconnect and packaging deposition methods and structures Cyprian Emeka Uzoh, Bulent M. Basol 2002-03-12
6354916 Modified plating solution for plating and planarization and process utilizing same Cyprian Emeka Uzoh, Bulent M. Basol 2002-03-12
6352623 Vertically configured chamber used for multiple processes Konstantin Volodarsky, Boguslaw Nagorski, Rimma Volodarsky, Douglas W. Young, Cyprian Emeka Uzoh 2002-03-05