Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6497800 | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating | Homayoun Talieh, Cyprian Emeka Uzoh | 2002-12-24 |
| 6482307 | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing | Jalal Ashjaee, Boguslaw Nagorski, Homayoun Talieh, Cyprian Emeka Uzoh | 2002-11-19 |
| 6471847 | Method for forming an electrical contact with a semiconductor substrate | Homayoun Talieh | 2002-10-29 |
| 6413403 | Method and apparatus employing pad designs and structures with improved fluid distribution | Paul Lindquist, Cyprian Emeka Uzoh, Homayoun Talieh | 2002-07-02 |
| 6413388 | Pad designs and structures for a versatile materials processing apparatus | Cyprian Emeka Uzoh, Homayoun Talieh | 2002-07-02 |
| 6354916 | Modified plating solution for plating and planarization and process utilizing same | Cyprian Emeka Uzoh, Homayoun Talieh | 2002-03-12 |
| 6355153 | Chip interconnect and packaging deposition methods and structures | Cyprian Emeka Uzoh, Homayoun Talieh | 2002-03-12 |