Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501187 | Semiconductor package structure having central leads and method for packaging the same | Nai Hua Yeh, Chen Peng, Chief Lin, Ching-Shui CHENG | 2002-12-31 |
| 6489572 | Substrate structure for an integrated circuit package and method for manufacturing the same | Mon Ho, Chih-Hong Chen, Yen-Cheng Huang, Li Huan Chen, Kuo-Feng Peng +2 more | 2002-12-03 |