Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501187 | Semiconductor package structure having central leads and method for packaging the same | Nai Hua Yeh, Chief Lin, Ching-Shui CHENG, Allis Chen | 2002-12-31 |
| 6472736 | Stacked structure for memory chips | Nai Hua Yeh | 2002-10-29 |
| 6400007 | Stacked structure of semiconductor means and method for manufacturing the same | Jichen Wu, Meng-Ru Tsai, Nai Hua Yeh | 2002-06-04 |