NY

Nai Hua Yeh

KT Kingpak Technology: 2 patents #1 of 11Top 10%
Overall (2002): #23,599 of 266,432Top 9%
3
Patents 2002

Issued Patents 2002

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6501187 Semiconductor package structure having central leads and method for packaging the same Chen Peng, Chief Lin, Ching-Shui CHENG, Allis Chen 2002-12-31
6472736 Stacked structure for memory chips Chen Peng 2002-10-29
6400007 Stacked structure of semiconductor means and method for manufacturing the same Jichen Wu, Meng-Ru Tsai, Chen Peng 2002-06-04