KP

Kuo-Feng Peng

KT Kingpak Technology: 1 patents #4 of 11Top 40%
Overall (2002): #54,128 of 266,432Top 25%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6489572 Substrate structure for an integrated circuit package and method for manufacturing the same Mon Ho, Chih-Hong Chen, Yen-Cheng Huang, Li Huan Chen, Jichen Wu +2 more 2002-12-03
6441496 Structure of stacked integrated circuits Wen-Chuan Chen, Jichen Wu, Chia-Jung Chang 2002-08-27