Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489572 | Substrate structure for an integrated circuit package and method for manufacturing the same | Mon Ho, Chih-Hong Chen, Yen-Cheng Huang, Kuo-Feng Peng, Jichen Wu +2 more | 2002-12-03 |