Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472460 | Polymer composite material and process for preparing the same | Makoto Kato, Naoki Hasegawa, Arimitsu Usuki, Norio Sato | 2002-10-29 |
| 6438826 | Electronic component, method of sealing electronic component with resin, and apparatus therefor | Shinji Takase, Michio Osada, Kouichi Araki | 2002-08-27 |
| 6436331 | Method of resin sealing a gap between a semiconductor chip and a substrate | Takaki Kuno, Shoji Yamamoto, Teikou Odashima | 2002-08-20 |