Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436331 | Method of resin sealing a gap between a semiconductor chip and a substrate | Takaki Kuno, Hirotaka Okamoto, Shoji Yamamoto | 2002-08-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6436331 | Method of resin sealing a gap between a semiconductor chip and a substrate | Takaki Kuno, Hirotaka Okamoto, Shoji Yamamoto | 2002-08-20 |