Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6470340 | Inter-program linking system and method thereof | Emiko Kawai, Yoshio Kashimura, Kenichi Uemura, Takamitsu Inagi | 2002-10-22 |
| 6436331 | Method of resin sealing a gap between a semiconductor chip and a substrate | Takaki Kuno, Hirotaka Okamoto, Teikou Odashima | 2002-08-20 |