MO

Michio Osada

TO Towa: 1 patents #3 of 11Top 30%
Overall (2002): #151,531 of 266,432Top 60%
1
Patents 2002

Issued Patents 2002

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6438826 Electronic component, method of sealing electronic component with resin, and apparatus therefor Shinji Takase, Hirotaka Okamoto, Kouichi Araki 2002-08-27