Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6438826 | Electronic component, method of sealing electronic component with resin, and apparatus therefor | Shinji Takase, Hirotaka Okamoto, Michio Osada | 2002-08-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6438826 | Electronic component, method of sealing electronic component with resin, and apparatus therefor | Shinji Takase, Hirotaka Okamoto, Michio Osada | 2002-08-27 |