Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6471501 | Mold for fabricating semiconductor devices | Yasuhiro Shinma, Muneharu Morioka, Norio Fukasawa, Yuzo Hamanaka, Tadashi Uno +1 more | 2002-10-29 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2002-10-29 |
| 6469370 | Semiconductor device and method of production of the semiconductor device | Toshimi Kawahara, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa, Yuzo Hamanaka +2 more | 2002-10-22 |
| 6455920 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka | 2002-09-24 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Fumihiko Taniguchi, Kunio Kodama, Eiji Watanabe, Masataka Mizukoshi, Hiroyuki Matsui | 2002-02-05 |