Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489676 | Semiconductor device having an interconnecting post formed on an interposer within a sealing resin | Akira Takashima | 2002-12-03 |
| 6472746 | Semiconductor device having bonding wires serving as external connection terminals | Akira Takashima | 2002-10-29 |
| 6404062 | Semiconductor device and structure and method for mounting the same | Sachiko Nogami, Akira Takashima | 2002-06-11 |
| 6388333 | Semiconductor device having protruding electrodes higher than a sealed portion | Kouhei Orikawa, Tadashi Uno, Fumihiko Ando, Akira Takashima, Hiroshi Onodera +2 more | 2002-05-14 |
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Hirohisa Matsuki, Kunio Kodama, Eiji Watanabe, Masataka Mizukoshi, Hiroyuki Matsui | 2002-02-05 |