Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489676 | Semiconductor device having an interconnecting post formed on an interposer within a sealing resin | Fumihiko Taniguchi | 2002-12-03 |
| 6472746 | Semiconductor device having bonding wires serving as external connection terminals | Fumihiko Taniguchi | 2002-10-29 |
| 6457633 | Method of forming a BGA-type semiconductor device having reliable electrical connection for solder balls | Kazuya KAMIMURA, Yoshikazu Kumagaya | 2002-10-01 |
| 6404062 | Semiconductor device and structure and method for mounting the same | Fumihiko Taniguchi, Sachiko Nogami | 2002-06-11 |
| 6388333 | Semiconductor device having protruding electrodes higher than a sealed portion | Fumihiko Taniguchi, Kouhei Orikawa, Tadashi Uno, Fumihiko Ando, Hiroshi Onodera +2 more | 2002-05-14 |
| 6383842 | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | Mitsutaka Sato, Shinichirou Taniguchi | 2002-05-07 |