Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383842 | Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom | Akira Takashima, Mitsutaka Sato | 2002-05-07 |
| 6379997 | Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same | Toshimi Kawahara, Sinya Nakaseko, Mitsunada Osawa, Mayumi Osumi, Hiroyuki Ishiquro +3 more | 2002-04-30 |